Potting, Molding & Encapsulating

Potting and encapsulating compounds are used to provide mechanical reinforcement to housed assemblies, to fill large voids, and to protect components from the effects of exposure to chemicals, moisture, mechanical shock and vibration. Sealing components with potting and encapsulating compounds prevents corrosion and ensures long-term integrity of the device.

VARIABLES TO CONSIDER WHEN SELECTING A POTTING OR ENCAPSULATING MATERIAL INCLUDE:

• Viscosity of uncured compound
• Dispensing requirements
• Device operating temperature
• Desired chemical resistance
• Desired thermal conductivity
• Desired flame retardance
• Hardness of cured product
• Overall cost